4月15日,自研市场有消息传出,应成小米日前内部宣布,立芯纲手本子在手机部产品部组织架构下成立芯片平台部,片平任命秦牧云担任芯片平台部负责人,台部向产品部总经理李俊汇报。自研
资料显示,应成秦牧云此前曾在高通任职,立芯担任高通产品市场高级总监,片平纲手本子后加入小米。台部
但在当天傍晚,自研小米集团公关部总经理王化发文回应关于成立芯片平台部相关消息,应成表示小米集团的立芯手机产品部的芯片平台部一直存在,主要负责收集产品芯片平台选型评估和深度定制,片平而秦牧云也加入小米已久。台部
26364
64
2025-04-17 00:00:00
383
989
2025-04-17 00:00:00
3
3
2025-04-17 00:00:00
5
7
2025-04-17 00:00:00
2
963
2025-04-17 00:00:00
75
33516
2025-04-17 00:00:00
9743
4899
2025-04-17 00:00:00
19
42132
2025-04-17 00:00:00
2
52344
2025-04-17 00:00:00
96748
5
2025-04-17 00:00:00
36
732
2025-04-17 00:00:00
84
7
2025-04-17 00:00:00
11
221
2025-04-17 00:00:00
4589
499
2025-04-17 00:00:00
64838
37464
2025-04-17 00:00:00
3
3324
2025-04-17 00:00:00
625
336
2025-04-17 00:00:00
7
7
2025-04-17 00:00:00
1462
29
2025-04-17 00:00:00
4
48924
2025-04-17 00:00:00
39481
48
2025-04-17 00:00:00
5
21682
2025-04-17 00:00:00
36786
1
2025-04-17 00:00:00
6
587
2025-04-17 00:00:00
613
81925
2025-04-17 00:00:00
7588
2883
2025-04-17 00:00:00
1
1
2025-04-17 00:00:00
18
3641
2025-04-17 00:00:00
1437
92789
2025-04-17 00:00:00
7
29
2025-04-17 00:00:00
4249
1972
2025-04-17 00:00:00
6
7
2025-04-17 00:00:00
5867
8349
2025-04-17 00:00:00
58
19
2025-04-17 00:00:00
8729
3
2025-04-17 00:00:00
227
85779
2025-04-17 00:00:00
1571
9
2025-04-17 00:00:00
8
42
2025-04-17 00:00:00
8113
72
2025-04-17 00:00:00
22626
29989
2025-04-17 00:00:00
46633
5
2025-04-17 00:00:00
6852
2
2025-04-17 00:00:00
1837
1311
2025-04-17 00:00:00
74599
294
2025-04-17 00:00:00
9
7
2025-04-17 00:00:00
68
9
2025-04-17 00:00:00
4
317
2025-04-17 00:00:00
823
31
2025-04-17 00:00:00
5
63453
2025-04-17 00:00:00
2
144
2025-04-17 00:00:00
477
11
2025-04-17 00:00:00
55936
149
2025-04-17 00:00:00
962
388
2025-04-17 00:00:00
69
3513
2025-04-17 00:00:00
2696
85
2025-04-17 00:00:00
56681
7439
2025-04-17 00:00:00
5613
831
2025-04-17 00:00:00
52
929
2025-04-17 00:00:00
14895
7955
2025-04-17 00:00:00
79417
74264
2025-04-17 00:00:00
184
5
2025-04-17 00:00:00